The pressures experienced currently by electronics manufacturers in North America are economic, rather than regulatory, in nature. In addition to environmental pressures resulting from the element's toxicity, motivations include hazardous waste disposal concerns, workplace safety considerations, device reliability issues, market competitiveness and environmental corporate image maintenance. There are a number of reasons behind the effort to eliminate lead from electronic solder materials. However, because of opposition within the European community, the final deadline is less certain, with the current cut-off date estimated beyond 2004. Europe is also requiring lead-free electronics, as mandated by the 1998 Waste Electrical and Electronic Equipment directive (WEEE). Japanese electronics manufacturers have voluntarily mandated that products manufactured or sold domestically be lead-free by 2001. Click here to enlarge imageĪround the world, interest in lead-free solder alternatives is increasing dramatically, primarily because of initiatives in both Asia and Europe to rapidly eliminate the presence of leaded solders in electronic assemblies. ![]() Lead-free alloys must take a variety of forms, such as wire, bar, preforms, and as powder for solder paste (which is used in this stencil-print application). Two types of materials replace leaded solders effectively.įigure 1.
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